Photonic Systems Brown Bag Seminar Series

Thursday, November 16, 2006

11:45  am, RLE Haus  Conf. room 36-428

"Low Threshold VCSELs Recess-Integrated on Si-CMOS ICs"

James Perkins

A new heterogeneous integration technique has been developed and is being demonstrated for optical interconnect applications using vertical cavity surface emitting lasers (VCSELs).  Oxide-aperture 850 nm AlGaAs VCSEL pills 8 µm tall  and 90 µm in diameter have been put into recesses etched in the metal/dielectric stack covering a silicon integrated circuit chip, and solder bonded in place.  These devices show threshold currents in the 1 to 10 mA range and thermal characteristics similar to those of native substrate devices.  This technique has the potential to improve the thermal properties and array pitch of state the art flip chip bonding VCSEL integration techniques, while also providing the ground work for more parallel integration techniques.