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Electron-Beam Nanolithography

Fig 1. A cross-sectional scanning-electron micrograph of a 50-nm-wide line in photoresist with a 500-nm-wide undercut region on either side. The widening of the line towards the top of the image is an artifact of the imaging technique.

Liftoff and shadow evaporation are fabrication methods used to define metal features on surfaces. Liftoff uses a metal deposition on a patterned surface (usually a photoresist), followed by the chemical removal of the underlying layer, to leave a metal pattern. Shadow evaporation uses a suspended resist structure (such as is shown in figure 1, where the suspended structure is 50-nm wide and the undercut is 500-nm wide) with subsequent angled depositions of metal to create bilayer metal nanojunctions for applications in single-electronics and quantum computing.

Typically wet-chemical etching is used to define the undercut feature. This approach results in poor control of the undercut's extent, as well as some widening of the narrow suspended feature. The result is great difficulty in obtaining sub-50-nm features and robust undercut resist, wide enough to perform shadow evaporation, but not wide enough to collapse.

Fig 2. A 16-nm-wide gold line on a silicon surface defined using liftoff and processing methods developed in our group.

We have developed a new technique for liftoff and shadow-evaporation using a PMMA/PMGI bilayer that demonstrates superior resolution and undercut control relative to existing methods. This method uses novel development methods and defines the undercut using electron-beam lithography, rather than wet-chemical etching. The result is reproducible fabrication of nanowire features as narrow as 16 nm (see figure 2) using resist structures with undercuts that vary in dimension by less than 50 nm from run to run.

We have recently developed new resist processes capable of feature dimensions down to 11 nm. We are pursuing use of these structures for templating the self-assembly of quantum dots, thus combining top-down and bottom-up lithographic methods.

Students

Collaborators

  • Prof. Vladimir Bulovic (MIT, EECS)
  • Amanda Giermann (MIT, DMSE)
  • Prof. Carl Thompson (MIT, DMSE)
  • Dr. J. Aumentado (NIST, Boulder)

Additional Information

"Robust Shadow-Mask Evaporation via Lithographically-Controlled Undercut," B. Cord, C. Dames, J. Aumentado, K.K. Berggren, to appear in J. Vac. Sci. Tech. B.  Preprints available upon request.

Sponsors

  • AFOSR (Air Force)
  • ARO (Army)

 

 

 
 
       
 
 
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Quantum Nanostructures and Nanofabrication Group Prof. Karl K. Berggren