by RLE at MIT | Jun 8, 2020 | News Links
The design could advance the development of small, portable AI devices. «more» Related Links: Engineers put tens of thousands of artificial brain synapses on a single chip (MIT News) Jeehwan Kim Research Group Professor...
by RLE at MIT | Feb 11, 2020 | RLE Recent Papers
Hyun S. Kum, Hyungwoo Lee, Sungkyu Kim, Shane Lindemann, Wei Kong, Kuan Qiao, Peng Chen, Julian Irwin, June Hyuk Lee, Saien Xie, Shruti Subramanian, Jaewoo Shim, Sang-Hoon Bae, Chanyeol Choi, Luigi Ranno, Seungju Seo, Sangho Lee, Jackson Bauer, Huashan Li, Kyusang...
by RLE at MIT | Feb 11, 2020 | News Links
Next-generation devices made with new “peel and stack” method may include electronic chips worn on the skin. «more» Related Links: Engineers mix and match materials to make new stretchy electronics (MIT News) Professor Jeehwan Kim Jeehwan Kim...
by RLE at MIT | Oct 11, 2018 | News Links
Efficient method for making single-atom-thick, wafer-scale materials opens up opportunities in flexible electronics. «more» Related Links: Researchers quickly harvest 2‑D materials, bringing them closer to commercialization (MIT News) Professor Jeehwan Kim...
by RLE at MIT | Jan 24, 2018 | News Links
Design is major stepping stone toward portable artificial-intelligence devices. «more» Related Links: Engineers design artificial synapse for “brain-on-a-chip” hardware (MIT News) The Nanoelectronics Research Group Professor...