Archives
Peel and Stack: Ultimate Heterogeneous Integration for Next Generation Electronics — Prof. Jeehwan Kim
Posted November 8, 2021 at 3:17 pm
Posted November 8, 2021 at 3:17 pm
Engineers put tens of thousands of artificial brain synapses on a single chip
Posted June 8, 2020 at 2:37 pm
Posted June 8, 2020 at 2:37 pm
Heterogeneous integration of singlecrystalline complex-oxide membranes
Posted February 11, 2020 at 12:14 pm
Posted February 11, 2020 at 12:14 pm
Engineers mix and match materials to make new stretchy electronics
Posted February 11, 2020 at 12:05 pm
Posted February 11, 2020 at 12:05 pm
Researchers quickly harvest 2‑D materials, bringing them closer to commercialization
Posted October 11, 2018 at 10:14 am
Posted October 11, 2018 at 10:14 am
Engineers design artificial synapse for “brain-on-a-chip” hardware
Posted January 24, 2018 at 12:01 pm
Posted January 24, 2018 at 12:01 pm
Remote epitaxy through graphene enables two-dimensional material-based layer transfer
Posted April 20, 2017 at 9:47 am
Posted April 20, 2017 at 9:47 am
