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Carbon nanotube transistors make the leap from lab to factory floor

Carbon nanotube transistors make the leap from lab to factory floor

by RLE at MIT | Jun 1, 2020 | News Links

Technique paves the way for more energy efficient, 3D microprocessors. «more» Related Links: Carbon nanotube transistors make the leap from lab to factory floor (MIT News) Professor Max Shulaker Novel Electronic...
MIT engineers build advanced microprocessor out of carbon nanotubes

MIT engineers build advanced microprocessor out of carbon nanotubes

by RLE at MIT | Sep 5, 2019 | News Links

New approach harnesses the same fabrication processes used for silicon chips, offers key advance toward next-generation computers. «more» Related Links: MIT engineers build advanced microprocessor out of carbon nanotubes (MIT News) Novels Research Group...
DISC-FETs: Dual Independent Stacked Channel Field-Effect Transistors

DISC-FETs: Dual Independent Stacked Channel Field-Effect Transistors

by RLE at MIT | Jul 5, 2018 | RLE Recent Papers

Pritpal S. Kanhaiya, Gage Hills, Dimitri A. Antoniadis, and Max M. Shulaker DOI: 10.1109/LED.2018.2851191 Abstract: We experimentally demonstrate a three-dimensional (3D) field-effect transistor (FET) architecture leveraging emerging nanomaterials: Dual...
Three-dimensional integration of nanotechnologies for computing and data storage on a single chip

Three-dimensional integration of nanotechnologies for computing and data storage on a single chip

by RLE at MIT | Jul 6, 2017 | RLE Recent Papers

Max M. Shulaker, Gage Hills , Rebecca S. Park , Roger T. Howe , Krishna Saraswat , H.-S. Philip Wong & Subhasish Mitra doi:10.1038/nature22994 Abstract: The computing demands of future data-intensive applications will greatly exceed the capabilities of...
New 3‑D chip combines computing and data storage

New 3‑D chip combines computing and data storage

by RLE at MIT | Jul 6, 2017 | News Links

Advance points toward new generation of computers for coming superstorm of data. «more» Related Links: Professor Shulaker New 3‑D chip combines computing and data storage (MIT News)
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